Integrated camera and communication antenna

ABSTRACT

An apparatus includes a camera lens assembly and a printed circuit board attached to said camera lens assembly. The camera lens assembly may be configured to provide a forward view through a windshield of a vehicle. The printed circuit board generally comprises an antenna, a ground plane, and an image sensor. The antenna is generally disposed on a front surface of the printed circuit board. The ground plane may be disposed either on the front surface or within a layer of the printed circuit board. The image sensor is generally mounted on a back surface of the printed circuit board. The camera lens assembly is generally configured to focus an image of the forward view through the windshield on the image sensor.

This application relates to U.S. application Ser. No. 15/384,926, filedDec. 20, 2016, now U.S. Pat. No. 9,871,290, and U.S. application Ser.No. 15/385,050, filed Dec. 20, 2016, which are each incorporated byreference in their entirety.

FIELD OF THE INVENTION

The invention relates to vehicle sensing systems generally and, moreparticularly, to a method and/or apparatus for implementing anintegrated camera and communication antenna.

BACKGROUND

Conventional light/rain sensors, cameras, and communication antennae areimplemented as separate standalone modules. Rain sensor modules areattached to vehicle windshields. The antennae are mounted either belowthe dashboard, behind the windshield or in a module on the roof, aso-called shark fin antenna module. The space behind the rearview mirroris highly desirable due to the fact that it is wiped, it has open skyvisibility, and it faces the direction of travel. However, the spacebehind the rearview mirror is limited, especially in compact vehicles.

It would be desirable to implement an integrated camera andcommunication antenna.

SUMMARY

The invention concerns an apparatus including a camera lens assembly anda printed circuit board attached to said camera lens assembly. Thecamera lens assembly may be configured to provide a forward view througha windshield of a vehicle. The printed circuit board generally comprisesan antenna, a ground plane, and an image sensor. The antenna isgenerally disposed on a front surface of the printed circuit board. Theground plane may be disposed either on the front surface or within alayer of the printed circuit board. The image sensor is generallymounted on a back surface of the printed circuit board. The camera lensassembly is generally configured to focus an image of the forward viewthrough the windshield on the image sensor.

BRIEF DESCRIPTION OF THE FIGURES

Embodiments of the invention will be apparent from the followingdetailed description and the appended claims and drawings in which:

FIG. 1 is a diagram illustrating a vehicle having an integratedlight/rain sensor and communication antenna module in accordance with anembodiment of the invention;

FIG. 2 is a diagram illustrating an example implementation of anintegrated light/rain sensor and communication antenna module inaccordance with an example embodiment of the invention;

FIG. 3 is a diagram illustrating a top view of an integrated light/rainsensor and communication antenna module in accordance with an exampleembodiment of the invention;

FIG. 4 is a diagram illustrating example communication antennae of theintegrated light/rain sensor and communication antenna module of FIG. 1;

FIG. 5 is a diagram illustrating example vertical dimensions of anintegrated light/rain sensor and communication antenna module inaccordance with an embodiment of the invention;

FIG. 6 is a diagram illustrating a bottom (inner) surface of a lensassembly of an integrated light/rain sensor and communication antennamodule in accordance with an example embodiment of the invention;

FIG. 7 is a diagram illustrating example light paths of an integratedlight/rain sensor and communication antenna module in accordance with anexample embodiment of the invention;

FIG. 8 is a diagram illustrating an effect of a raindrop on the lightpath of FIG. 7;

FIG. 9 is a diagram illustrating views of another example lens assemblyof an integrated light/rain sensor and communication antenna module inaccordance with another example embodiment of the invention;

FIG. 10 is a diagram illustrating example light paths for tunnel anddaylight sensors associated with the lens assembly of FIG. 9;

FIG. 11 is a graph illustrating a relative light efficiency at varyingwindshield thicknesses of an integrated light/rain sensor andcommunication antenna module in accordance with an embodiment of theinvention;

FIG. 12 is a graph illustrating carrier-to-noise ratio (CNR) of variousembodiments of an integrated light/rain sensor and communication antennamodule in accordance with an embodiment of the invention;

FIG. 13 is diagram illustrating an example electronics portion of anintegrated light/rain sensor and communication antenna module inaccordance with an embodiment of the invention;

FIG. 14 is a diagram illustrating examples of alternative mountingspoints of an integrated light/rain sensor and communication antennamodule in accordance with an embodiment of the invention;

FIGS. 15 and 16 are diagrams illustrating alternative techniques ofmounting an integrated light/rain sensor and communication antennamodule in accordance with example embodiments of the invention;

FIG. 17 is a diagram illustrating a vehicle having an integrated cameraand communication antenna module in accordance with another exampleembodiment of the invention;

FIG. 18 is a diagram illustrating a front view of an exampleimplementation of an integrated camera and communication antenna modulein accordance with an example embodiment of the invention;

FIG. 19 is a diagram illustrating a viewing angle of the integratedcamera and communication antenna module of FIG. 17;

FIG. 20 is a diagram illustrating the integrated camera andcommunication antenna module of FIG. 17;

FIG. 21 is a diagram illustrating the integrated camera andcommunication antenna module further integrated with optional light/rainsensors;

FIG. 22 is a diagram illustrating a side cut-away view of the integratedcamera and communication antenna module of FIG. 21;

FIG. 23 is a diagram illustrating the cut-away view of the integratedcamera and communication antenna module of FIG. 22 from the rear;

FIG. 24 is a diagram illustrating example connectors of the integratedcamera and communication antenna module of FIG. 22;

FIG. 25 is a diagram illustrating a layout of a bottom surface of aprinted circuit board of the integrated camera and communication antennamodule in accordance with and example embodiment of the invention;

FIG. 26 is a diagram illustrating an example electronics portion of anintegrated camera and communication antenna module in accordance with anexample embodiment of the invention;

FIG. 27 is a diagram illustrating example a mounting points of anintegrated camera and communication antenna module in accordance with anexample embodiment of the invention; and

FIG. 28 is a diagram illustrating an example of an injection moldingmachine configured to manufacture a lens assembly in accordance with anexample embodiment of the invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Embodiments of the present invention include providing an integratedcamera and communication antenna that may (i) enable physicalintegration of an automotive image sensor with an RF antenna, (ii)provide rain sensing, (iii) provide ambient light sensing, (iv) providetunnel detection, (v) provide sunload sensing, (vi) take advantage ofspace behind a rearview mirror; (vii) integrate several featurestogether, (viii) provide a more compact solution when compared withexisting standalone solutions, (ix) offer a lower cost solution whencompared with standalone solutions, (x) enable faster assembly, (xi)enable physical integration of optical rain sensing with camera and anRF antenna, (xii) facilitate global location determination by one ormore satellite constellations such as GPS-Glonass-Beidou-Gallileo,(xiii) facilitate connectivity such as vehicle-to-vehicle (V2V),vehicle-to-infrastructure (V2I), and vehicle-to-everything (V2X)communication, (xiv) provide high-definition (HD) video with color highdynamic range (HDR) functionality, (xv) be implemented on a singleprinted circuit board, and/or (xvi) utilize a novel molded lensstructure.

Referring to FIG. 1, a diagram is shown illustrating placement of anintegrated light/rain sensor and communication antenna module inaccordance with an example embodiment of the invention in a vehiclecontext. In various embodiments, the space behind the rearview mirror 94of a vehicle 90 provides a desirable location for mounting an integratedlight/rain sensor and communication antenna module 100 in accordancewith an embodiment of the invention. The integrated light/rain sensorand communication antenna module 100 is generally mounted on a back(interior) surface of a windshield 92 of the vehicle 90. In variousembodiments, the integrated light/rain sensor and communication antennamodule 100 is attached to the windshield using a transparent adhesivematerial (or gasket). The location on the windshield behind (or near)the rearview mirror is desirable because it is wiped, it has open skyvisibility, and it faces the direction of travel of the vehicle 90.

Referring to FIG. 2, a diagram is shown illustrating an exampleimplementation of the integrated light/rain sensor and communicationantenna module 100 of FIG. 1. In various embodiments, the integratedlight/rain sensor and communication antenna module 100 comprises a front(or upper) cover 102 and a back (or lower) cover 104. The covers 102 and104 generally encase a single printed circuit board with a communicationantenna (illustrated by long dashed lines). The cover (or lens assembly)102 generally includes a plurality of molded elongated featurescomprising pairs of convex lenses (illustrated by short dashed lines).In various embodiments, the cover 102 may be formed from opaque infraredtransmitting filter plastic. In various embodiments, the molded lensassembly and cover 102 may comprise a dielectric, microwave and infraredtransparent, moldable plastic material (e.g., an acrylic infraredtransmitting resin). In various embodiments, the molded lens assembly102 may be configured to provide at least four optical paths and acentral atrium. The four optical paths are generally arrangedorthogonally, such that adjacent optical paths are at right angles toone another (e.g., in x-y plane). However, other numbers of light pathssurrounding a central atrium may be implemented accordingly, with eachlight path aligned with (or forming) a side of a polygon (e.g., square,hexagon, octagon, etc.). In various embodiments, the orthogonal (orpolygonal) layout of the optical paths provides an open atrium (orcavity or space) in the center of the optical paths, in which thecommunication antenna may be placed. In various embodiments, the covers102 and 104 may be configured to snap together for easy assembly.However, other methods of assembling (fastening) the covers 102 and 104(e.g., cementing, gluing, fusing, etc.) may be implemented.

Referring to FIG. 3, a diagram is shown illustrating a top view of theintegrated light/rain sensor and communication antenna module 100 inaccordance with an example embodiment of the invention. In variousembodiments, the cover 102 and a printed circuit board 106 are arrangedsuch that (i) the four optical paths provided by the molded elongatedlens features are aligned with a periphery of the printed circuit board106 and (ii) emitters and detectors (e.g., located in corners of theprinted circuit board) are positioned at intersections of two adjacentoptical paths of the molded elongated lens features. In variousembodiments, the emitters and detectors are located in opposite cornersof the printed circuit board (e.g., emitters on one diagonal of a squareprinted circuit board and detectors another diagonal of the squareprinted circuit board).

In various embodiments, the printed circuit board 106 is configured tokeep emitter-detector spacing within 45×45 mm. In some embodiments, theprinted circuit board 106 is configured to provide a maximumemitter-detector spacing of 40 mm. In still other embodiments, theprinted circuit board 106 is configured to provide an emitter-detectorspacing of approximately 37 mm. A communication antenna 108 may beimplemented or mounted in a central area of the printed circuit board106, and fitting within the cavity defined by the molded elongated lensfeatures of the cover 102. In various embodiments, the printed circuitboard 106 implements a ground plane for the communication antenna 108.In some embodiments, the ground plane may be on a front(windshield-facing) side of the printed circuit board 106. In someembodiments, the ground plane may be implemented within a layer of theprinted circuit board 106. In various embodiments, the detectors may bemounted on a backside (e.g., opposite to the windshield-facing/groundplane side) of the printed circuit board 106. In various embodiments,the detectors may be mounted looking through via holes in the printedcircuit board 106. In an example, the via holes may be implemented witha diameter of about 1.2 mm.

Referring to FIG. 4, a diagram is shown illustrating exampleimplementations of the communication antenna 108 of FIG. 3. In someembodiments, a printed circuit board 106 a may comprise an antenna 108a, a ground plane 112 a, a pair of emitter vias 114, a pair of detectorvias 116, and an RF connector 118 a (e.g., a MOLEX FAKRA connector). Insome embodiments, a printed circuit board 106 b may comprise an antenna108 b, a ground plane 112 b, a pair of emitters 120, a pair of detectors122, and an RF connector 118 b (e.g., a MOLEX Mini50 connector). In anexample, the emitters 120 may be mounted on the windshield-facing sideof the printed circuit board 106 b and the detectors 122 may be mountedon the backside of the printed circuit board 106 b in alignment withvias 124. In some embodiments, a through hole emitter (e.g., having aflat front surface) may allow the emitters 120 to be mounted on thebackside of the printed circuit boards 106 a and 106 b in alignment withcorresponding vias (not shown).

In various embodiments, the antenna 108 a and the antenna 108 b may beimplemented, for example, as a TAOGLAS surface mount SGP.18c GPS L1 band18×18 mm ceramic patch antenna, with 45×45 mm ground planes on 1.2 mmthick printed circuit boards. However, other radiating elements may beconsidered for the antennae 108 a and/or 108 b, including but notlimited to a TYCO dual band GPS L1-V2x puck antenna, other GPS L1 bandceramic patch antennae, a stacked multiband patch antenna, a foldeddipole antenna, an inverted F cellular band antenna, an IEEE 802.11a/b/g/n “WiFi” antenna, a XM satellite radio antenna, an IEEE 802.15.1BLUETOOTH antenna, an IEEE 802.15.4 ZIGBEE antenna, an IEEE 802.11p 5.9GHz antenna for vehicle-to-vehicle (V2V) or vehicle-to-infrastructure(V2I), referred to collectively as vehicle-to-everything (V2X), etc.IEEE 802.11p is an approved amendment to the IEEE 802.11 standard to addwireless access in vehicular environments (WAVE), a vehicularcommunication system. IEEE 802.11p defines enhancements to 802.11 (e.g.,found in products marketed as Wi-Fi) that support IntelligentTransportation Systems (ITS) applications.

Referring to FIG. 5, a diagram is shown illustrating example verticaldimensions of an integrated light/rain sensor and communication antennamodule in accordance with an embodiment of the invention. In variousembodiments, the integrated light/rain sensor and communication antennamodule 100 is attached to the backside of the windshield 92 by atransparent adhesive material (or gasket) 110. The windshield 92, thecover 102, and the gasket material 110 generally have similar indexes ofrefraction (e.g., n=˜1.5). In various embodiments, the integratedlight/rain sensor and communication antenna module 100 may be configuredto accommodate a range of windshield thicknesses (e.g., 4.8 to 6.0 mm).In an example, the integrated light/rain sensor and communicationantenna module 100 may be configured for a windshield thicknesses rangeof 5.4+/−0.6 mm, and windshield radius of at least 1400 mm.

In various embodiments, an essentially planar portion of the cover 102that is cemented on the backside (interior) of the windshield has athickness of approximately 2 mm. The printed circuit board 106 isgenerally attached to the cover 102 such that there is a gap ofapproximately 10.7 mm between an interior surface of the planar portionof the cover 102 and the front (windshield-facing) surface of theprinted circuit board 106. The gap generally accommodates a verticaldimension of the molded elongated lens feature portions of the cover 102(not shown for clarity) and a vertical dimension (e.g., 4.7 mm) of theantenna 108.

Referring to FIG. 6, a diagram is shown illustrating an example bottom(inner) surface of the molded cover and lens assembly 102 in accordancewith an embodiment of the invention. In various embodiments, the coverand molded lens assembly 102 may comprise four molded elongated lensfeatures 130. In four light path embodiments, the molded elongated lensfeatures 130 are laid out orthogonally (perpendicular) to one another.Each feature 130 comprises a first convex lens portion 132 and a secondconvex lens portion 134. In some embodiments, a filled solid region 136may be formed between the first and second portions of one or more ofthe molded elongated lens features 130. The filled solid region 136 maybe omitted without affecting functionality of the lens assembly 102. Oneor more of the filled solid region 136 may be configured to providedother optical sensor functionality (e.g., a tunnel sensor, a sunloadsensor, etc.).

The first convex lens portion 132 and a second convex lens portion 134are generally filled solids. A curvature of the lens portions 132 and134 is configured to allow operation over a range of windshieldthicknesses. The molded lens assembly and emitter-detector spacing aregenerally configured to implement an optical path providing an angle ofincidence to obtain total internal refraction at the front surface ofthe windshield 92. In various embodiments, the convex lens portions 132and 134 are configured for an angle of incidence greater than 42 degrees(e.g., 45 degrees).

Referring to FIG. 7, a diagram is shown illustrating example light pathsof the integrated light/rain sensor and communication antenna module 100with the lens assembly of FIG. 6. In general, light (e.g., infraredlight) emitted by an emitter mounted on the front surface of the printedcircuit board 106 passes through the lens portion 134 and is collimatedand directed toward a plane 138 that bisects the elongated lens feature130. At the outer surface of the windshield 92, the light is refractedinternally and travels toward the lens portion 132. The lens portion 132focuses the refracted light on the detector 122 (e.g., through a via inthe printed circuit board 106). Each detector 122 can receive light fromeach of the emitters 120 using a different optical path/feature 130. Insome embodiments, the emitters 120 are alternately switched on, and bothof the detectors 122 are sampled. In some embodiments, the emitters 120may be modulated with different frequencies to allow each detector 122to measure ambient and both optical paths simultaneously.

Referring to FIG. 8, a diagram is shown illustrating an effect of araindrop on the light path of FIG. 7. The amount of rain on thewindshield 92 generally affects the intensity of lightreflected/refracted to the detector 122. When the windshield 92 is dry,total internal refraction of the light occurs. When a raindrop ispresent, some of the light “leaks” from the windshield 92, reducing theintensity of light seen by the detector 122. The detector signal isgenerally interpreted to estimate the rainfall rate and a control signalgenerated to control a vehicle component (e.g., the speed of the wipers)automatically.

Referring to FIG. 9, a diagram is shown illustrating top (a) and bottom(b) views of another example molded lens assembly in accordance withanother embodiment of the invention. In some embodiments, a molded lensassembly and cover 102′ may include additional optics 140 and/or 150. Invarious embodiments, the additional optics 140 and/or 150 may beimplemented (formed, molded, machined, etc.) in the solid filled regions136 of one or more of the molded elongated lens features 130. In someembodiments, the optics 140 and 150 are implemented on opposite sides ofthe lens assembly 102′. In some embodiments, the optics 140 and 150 maybe formed in adjacent features 130 of the lens assembly 102′. Theadditional optics 140 and 150 may be included in the molded lensassembly to facilitate automatic control of headlights and dashboardlights by sensing outside (ambient) and tunnel light levels.

Referring to FIG. 10, a diagram is shown illustrating example lightpaths for tunnel and daylight sensors associated with the molded lensassembly of the cover 102′ of FIG. 9. In some embodiments, the optics140 and/or 150 may be included for sensing outside (ambient) and/ortunnel light levels, respectively. The optic 140 may act as a light pipeproviding wide angle sunlight detection. The optic 150 may be configuredto provide a narrow angle tunnel sensor.

Referring to FIG. 11, a graph 160 is shown illustrating a relative lightefficiency at varying windshield thicknesses of an integrated light/rainsensor and communication antenna module in accordance with an embodimentof the invention. The graph 160 illustrates simulation of a light/rainsensor in accordance with an embodiment of the invention for windshieldthickness offsets from 4.2 mm to 6.6 mm. Simulations are shown for aflat windshield and a windshield with a radius of 1400 mm (e.g., convexas seen from outside the vehicle 90). The simulation shows thelight/rain sensor in accordance with an embodiment of the inventionworks well for a range of thicknesses (e.g., 4.8 mm to 6.0 mm) coveringa majority of windshields.

Referring to FIG. 12, a graph 170 is shown illustrating an effect of thelens assembly and cover 102 on a GPS signal. The plastic lens assemblyand cover 102 with or without the molded elongated lens features 130generally reduces the carrier-to-noise ratio (CNR) by approximately 1-2dB. However, even with this reduction performance is still within anacceptable operating range.

Referring to FIG. 13, a diagram is shown illustrating an exampleelectronics portion of an integrated light/rain sensor and communicationantenna module in accordance with an embodiment of the invention. Invarious embodiments, electronic circuits of the integrated light/rainsensor and communication antenna module 100 are mounted on the backsideof the printed circuit board 106. In an example, the electroniccircuitry may comprise a processing (or control) circuit 200. In variousembodiments, the control circuit 200 comprises a processor 202 and rainlight sensor module 204. In an example, the rain light sensor module 204communicates with the processor 202 via a serial communicationconnection (e.g., I²C, SPI, etc.). The rain light sensor module 240 maybe configured to manage a pair of emitters 206 a and 206 b, and a numberof detectors 208 a-208 n. The detectors 208 a-208 n may be divided intoambient channels and rain channels. In various embodiments, the emitter206 a and 206 b may be implemented as light emitting diodes (LEDs) andthe detectors 208 a-208 n may be implemented as photo diodes or phototransistors. In an example, the emitter 206 a and 206 b may beimplemented as infrared or near infrared emitting diodes (e.g., OSRAMSFH 4053, available from OSRAM Opto Semiconductors GmbH) and thedetectors 208 a-208 n may be implemented as Silicon PIN photo diodes(e.g., OSRAM SFH 2400 FA, available from OSRAM Opto SemiconductorsGmbH).

The processor 202 may be connected to a number of blocks (or circuits)210-222. In an example, the block 210 may be implemented as a vehicleCAN bus, a block 212 may implement a removable memory slot (e.g., SD,MMC, etc.), a block 214 may be implemented as a flash memory, a block216 may be implemented as a random access memory (RAM), a block 218 mayimplement a surface acoustic wave (SAW) filter for receiving globalnavigation satellite system (GNSS) signals, a block 220 may implement aradio (e.g., cellular, GSM, UMTS, LTE, IEEE 802.11n, etc.) communicationmodem, and the block 222 may implement a clock crystal. The vehicle CANbus 210 generally allows the processor 202 to control features (e.g.,headlights, dash lights, windshield wipers, etc.) of the vehicle 90. Theremovable memory slot 212 allows the processor 202 to access extramemory and or applications (program code). In an example, the flashmemory 214 may be implemented as a parallel NOR flash memory. However,other types of flash memory may be implemented accordingly to meetdesign criteria of a particular application. The RAM 216 may beimplemented as a parallel access static RAM (SRAM). The SAW filter 218may be configured to couple a GPS (global positioning system) or GNSS(global navigation satellite system) antenna (e.g., antenna 108) to alow noise amplifier (LNA) input of the processor 202. The modem 220 maybe connected to a universal asynchronous receiver transmitter (UART)port of the processor 202. The clock crystal 222 may provide timingsignals for synchronizing operations of the processing circuit 200. Thecircuit 202 may also be connected to a power supply 224 configured toprovide one or more supply voltages (e.g., VDC LPVR, VDD18, etc.) forthe circuit 200 from a battery voltage of a vehicle battery. The powersupply 224 may also power a transmitter crystal oscillator (TXCO) 226.

Referring to FIG. 14, a diagram is shown illustrating example mountingpoints of an integrated light/rain sensor and communication antennamodule in accordance with example embodiments of the invention. Invarious embodiments, the space behind (or near) the rearview mirror 94of the vehicle 90 provides a desirable location for mounting theintegrated light/rain sensor and communication antenna module 100. Theintegrated light/rain sensor and communication antenna module 100 isgenerally mounted on a back (interior) surface of the windshield 92 neara location where the rearview mirror is mounted. The location on thewindshield behind the rearview mirror is desirable because it is wiped,it has open sky visibility, and it faces the direction of travel of thevehicle 90. In various embodiments, the integrated light/rain sensor andcommunication antenna module 100 is attached to the windshield 92 usinga transparent adhesive material (or gasket) 254. In some embodiments,the integrated light/rain sensor and communication antenna module 100may be attached to a the windshield 92 using a mounting frame 250attached to the windshield 92 (illustrated in FIG. 15), or by slidingthe integrated light/rain sensor and communication antenna module 100into a groove of mounting frame attached to the windshield 92(illustrated in FIG. 16).

Referring to FIG. 15, a diagram is shown illustrating an alternativetechnique of removably mounting the integrated light/rain sensor andcommunication antenna module 100 to the windshield 92. In someembodiments, the integrated light/rain sensor and communication antennamodule 100 may be inserted into a mounting frame 300. The mounting frame300 is first mounted to the windshield 92 using a transparent adhesivematerial (or gasket) 254. The integrated light/rain sensor andcommunication antenna module 100 is inserted into the mounting frame 300and a sheet metal clip 302 is snap onto tabs 304 locking the integratedlight/rain sensor and communication antenna module 100 into position.The process is simply reversed to remove the integrated light/rainsensor and communication antenna module 100.

Referring to FIG. 16, a diagram is shown illustrating an alternativetechnique of removably mounting the integrated light/rain sensor andcommunication antenna module 100 in accordance with example embodimentof the invention. In some embodiments, a mounting frame 400 may beattached to the windshield 92 using, for example, an adhesive material402. The integrated light/rain sensor and communication antenna module100 may be configured to slide into a groove in the mounting frame 400,placing the integrated light/rain sensor and communication antennamodule 100 in contact with the back (interior) surface of the windshield92.

Referring to FIG. 17, a diagram is shown illustrating an integratedcamera and communication antenna module in accordance with anotherexample embodiment of the invention mounted in a vehicle context. Invarious embodiments, an integrated camera and communication antennamodule 500 may be mounted on a backside (interior) surface of thewindshield 92 of the vehicle 90. The integrated camera and communicationantenna module 500 may be mounted between the windshield 92 and therearview mirror 94 of the vehicle 90.

Referring to FIG. 18, a diagram is shown illustrating a front view of anexample implementation of the integrated camera and communicationantenna module 500 of FIG. 17. In various embodiments, the integratedcamera and communication antenna module 500 may be mounted to thewindshield 92 by a windshield mount 502. A light trap 504 may beattached to a camera lens of the integrated camera and communicationantenna module 500.

Referring to FIG. 19, a diagram is shown illustrating a field of viewangle of the integrated camera and communication antenna module 500 ofFIG. 17. In general, the vehicle 90 may limit a vertical field of viewof the integrated camera and communication antenna module 500 whenmounted on the windshield 92. In an example, an angle α between ahorizontal plane of the integrated camera and communication antennamodule 500 and the front (or nose) of the vehicle 94 may beapproximately 15.73 degrees. In an example, the integrated camera andcommunication antenna module 500 may be configured to have a field ofview (FOV) of β degrees from the horizontal plane. In an example, β maybe ±15 degrees. Configuring the integrated camera and communicationantenna module 500 to eliminate the vehicle from the field of viewgenerally maximizes a usable image area.

Referring to FIGS. 20 and 21, diagrams are shown illustrating an exampleembodiment of the integrated camera and communication antenna module 500of FIG. 17 with only a communication antenna assembly (FIG. 20) andfurther integrated with an optional light/rain sensor assembly (FIG.21). In various embodiments, the integrated camera and communicationantenna module 500 may comprise a front (or upper) cover 506 and a back(or lower) cover 508. The covers 506 and 508 generally encase a singleprinted circuit board with a communication antenna (illustrated by longdashed lines) mounted on a top surface and camera sensor and electronicsmounted on a bottom surface (illustrated in FIG. 24).

In some embodiments, the upper cover 506 may further comprise a moldedlens assembly (illustrated in FIG. 21 by short dashed lines), asdescribed above in connection with FIG. 2. In various embodiments, thecover 506 may be formed from opaque infrared transmitting filterplastic. The molded lens assembly is generally configured to provide atleast four optical paths and a central space in which the communicationantenna fits. In embodiment implementing only four optical paths, thefour optical paths are generally arranged orthogonally, such thatadjacent optical paths are at right angles to one another (e.g., in x-yplane). In various embodiments, the orthogonal layout of the opticalpaths provides an open atrium (or cavity or space) in the center of theoptical paths, and in which the communication antenna may be placed. Insome embodiments, the molded lens assembly in the cover 506 may alsoinclude optics for sunlight sensing and tunnel light level sensing.

In various embodiments, the lower cover 508 may be configured to providespace for a light path from a camera lens 510 to the camera sensor onthe backside of the printed circuit board within the integrated cameraand communication antenna module 500. In various embodiments, the covers506 and 508 may be configured to snap together for easy assembly. Forexample, in some embodiments a snap-fit connection may be implemented.However, other methods of assembling (fastening) the covers 506 and 508(e.g., cementing, gluing, fusing, etc.) may be implemented.

Referring to FIG. 22, a diagram is shown illustrating a side cut-awayview of the integrated camera and communication antenna module 500 ofFIG. 21. In an example, light passing through the camera lens 510 isdirected onto a mirror 512 and focused onto a camera sensor 514 on thebackside of a printed circuit board 516. In some embodiments, the mirror512 may be replaced by a prism (e.g., a pentaprism). In someembodiments, the camera sensor 514 may comprise a fully integratedsystem-on-chip (SoC) automotive image sensor combining high-definition(HD) video (e.g., 720p/30, etc.) with color high dynamic range (HDR)functionality. The camera sensor 514 may be configured for wide field ofview and multi-camera applications. The camera sensor 514 may have anability to simultaneously deliver high-quality video and sceneinformation content, allowing the camera sensor 514 to supportautomotive applications that involve concurrent vision and sensingfunctions. In an example, the camera sensor 514 may configured toprovide fully-processed, display-ready color HDR video output in 8- or10-bit YUV format, or 10- to 18-bit combined RAW RGB HDR output withcomplete user control over formatting and data transfer. The integratedcamera and communication antenna module 500 generally allowsnext-generation camera interfaces and advanced automotive systemarchitectures, such as Ethernet-based, vehicle-to-vehicle (V2V), andvehicle-to-infrastructure (V2I) driver assistance solutions.

Referring to FIG. 23, a diagram is shown illustrating the cut-away viewof the integrated camera and communication antenna module 500 of FIG. 22rotated to expose a rear elevation.

Referring to FIG. 24, a diagram is shown illustrating exampleconnections of the integrated camera and communication antenna module500. In an example, the integrated camera and communication antennamodule 500 may have a connector 518 and a connector 520. The connector518 may be implemented using a MOLEX Mini50 connection system. Theconnector 520 may be implemented using a MOLEX FAKRA connector system(e.g., a RF connection and/or video FPD-Link III link).

Referring to FIG. 25, a diagram is shown illustrating a layout of thebottom surface of the printed circuit board 516 in accordance with andexample embodiment of the invention. In various embodiments, a number ofintegrated circuits (or chips) may be mounted on the backside of theprinted circuit board 516. In an example, the number of chips mayinclude, but are not limited to, a GPS chipset 522, a camera sensor chip524, a serializer chip 526, and an optional rain/light sensor chip 528.In embodiments with the rain/light sensor capability, the printedcircuit board 516 would also comprise sets of emitters (e.g., IRLEDs)and sets of detectors (e.g., photodiodes or photo-transistors). In anexample, the chip 522 may be implemented with a fully integratedGPS/Galileo/Glonass/BeiDou/QZSS receiver with high performanceprocessing capability (e.g., a TESEO STA8090EXG chip fromSTMicroelectronics). The chip 524 may be implemented as a automotiveimage sensor chip (e.g., an Omni Vision OV10635 camera sensor chip fromOmniVision Technologies). The chip 526 may be implemented using a 25 MHZto 100 MHz 10/12-bit FPD-Link III Serializer (e.g., a DS90UB913Aserializer chip from Texas Instruments). The optional rain/light sensorchip 528 may be implemented using a Melexis MLX75308 rain sensor chip.

Referring to FIG. 26, a diagram is shown illustrating an exampleelectronics portion of an integrated camera and communication antennamodule in accordance with an example embodiment of the invention. Invarious embodiments, electronic circuits of the integrated camera andcommunication antenna module 500 are mounted on the backside of theprinted circuit board 506. In an example, the electronic circuitrycomprises a processing (or control) circuit 600. The control circuit 600comprises a processor 602, a camera sensor 604 and a serializer 606. Inembodiments including a light/rain sensing capability, the controlcircuit 600 may also comprise an optional rain light sensor module 608.

The optional rain light sensor module 608 may be connected to theprocessor 602 via a serial communication connection bus (e.g., I²C, SPI,etc.). The rain light sensor module 608 may be configured to managed apair of emitters 610 a and 610 b, and a number of detectors 612 a-612 n.The detectors 612 a-612 n may be divided into ambient channels and rainchannels. In various embodiments, the emitters 610 a and 610 b may beimplemented as light emitting diodes (LEDs) and the detectors 612 a-612n may be implemented as photo diodes or photo transistors. In anexample, the emitters 610 a and 610 b may be implemented as infrared ornear infrared emitting diodes.

In various embodiments, the processor 602 may be implemented as anembedded processor or controller (e.g., an ARM core, etc.). Theprocessor 602 may be connected to a number of blocks (or circuits)614-626. In an example, the block 614 may represent a vehicle CAN(controller are network) bus, a block 616 may implement a removablememory slot (e.g., SD, MMC, etc.), a block 618 implements a flashmemory, a block 620 may implement a random access memory (RAM), a block622 may implement a surface acoustic wave (SAW) filter, a block 624implementing a radio communication (e.g., cellular, GSM, UMTS, LTE,WiFi, IEEE 802.11n, etc.) modem, and the block 626 may implement a clockcrystal.

The processor 602 may be configured to control features (e.g.,headlights, dash lights, windshield wipers, etc.) of a vehicle via thevehicle CAN bus 614. The processor 602 may also be configured toexchange inertial measurement unit (IMU) data with the vehicle 90 viathe vehicle CAN bus 614. In various embodiments, the processor 602 maybe configured to support either standard ISO 15765 or extended ISO 15765protocols. However, other protocols may be implemented, including, butnot limited to, ISO 15764-4 (CAN), ISO 14230-4 (Keyword Protocol 2000),ISO 9141-2 (Asian, European, Chrysler vehicles), SAE J1850 VPW (GMvehicles), SAE J1850 PWM (Ford vehicles), SAE J2411 (GM LAN, single wireCAN), and Ford MSC (medium speed CAN).

The removable memory slot 616 allows the processor 602 to access extramemory (e.g., SD/MMC cards), applications (program code), subscriberinformation modules (e.g., SIM cards), etc. In an example, the flashmemory 618 may be implemented as a parallel NOR flash memory. However,other types of flash memory may be implemented accordingly to meetdesign criteria of a particular application. In an example, the RAM 620may be implemented as a parallel access static RAM (SRAM). However,other types of RAM may be implemented accordingly to meet designcriteria of a particular application. The SAW filter 622 may beconfigured to couple a GPS (global positioning system) or GNSS (globalnavigation satellite system) antenna (e.g., antenna 108) to a low noiseamplifier (LNA) input of the processor 602. The modem 624 may beconnected to a universal asynchronous receiver transmitter (UART) portof the processor 602. The clock crystal 626 may provide timing signals(e.g., reference clock) for synchronizing operations of the processingcircuit 600. The circuit 602 may also be connected to a power supply 630configured to provide one or more supply voltages (e.g., VDC LPVR,VDD18, etc.) for the circuit 600 from a battery voltage of a vehiclebattery.

The camera sensor 604 and serializer 606 are generally connectedtogether and configured to convert an image focused on the camera sensor604 into a serial bitstream containing image data (e.g., pixels,synchronization signals, etc.). The serializer 608 may be configured tocommunicate the serial bitstream (e.g., via serial peripheral interfaceor SPI) to an external processor 628 for further processing. In anexample, the external processor 628 may be part of an automated driverassistance system (ADAS) configured to provide warnings (e.g., laneincursion, collision, lane crossing, etc.) and/or control features ofthe vehicle (e.g., brakes, navigation, etc.).

Referring to FIG. 27, a diagram is shown illustrating example mountingpoints of a rain sensor and the integrated camera and communicationantenna module 500 in accordance with an example embodiment of theinvention. In various embodiments, the space behind the rearview mirrorof the vehicle 94 provides a desirable location for mounting theintegrated camera and communication antenna module 500. The integratedcamera and communication antenna module 500 is generally mounted on aback (inner) surface of the windshield 92 near a location where therearview mirror 94 of the vehicle 90 is mounted. The location on thewindshield behind the rearview mirror 94 is desirable because it iswiped, it has open sky visibility, and it faces the direction of travelof the vehicle 94. In various embodiments, the integrated camera andcommunication antenna module 500 is attached to the windshield 92 usinga transparent adhesive material (or gasket). In some embodiments, alight/rain sensor may be integrated in the integrated camera andcommunication antenna module 500 or attached to a separate location onthe windshield 92.

Referring to FIG. 28, a diagram of an injection molding machine 700illustrating an example process for manufacturing a lens assembly andcover in accordance with an example embodiment of the invention. In anexample, a process (or method) of manufacturing a molded lens assemblyand cover as described above in connections with FIG. 2) may compriseloading resin pellets into a hopper 702 of the injection molding machine700. In various embodiments, the resin pellets may comprise adielectric, microwave and infrared transparent, moldable plasticmaterial (e.g., an acrylic infrared transmitting resin). The injectionmolding machine 700 may be configured to heat the resin pellets untilmolten and inject the molten resin into a mold 704. The mold 704 isconfigured to form a molded lens assembly and cover in accordance withan example embodiment of the invention from the molten resin. Theinjection molding machine 700 cools the mold 704 until the molten resinhas set. The molded lens assembly and cover in accordance with anexample embodiment of the invention is then removed from the mold andthe process repeated.

The mold 704 is generally configured to form at least one molded lensassembly and cover. In an example embodiment, the molded lens assemblyand cover generally comprises a substantially planar cover portionhaving sides extending down at a periphery of the planar portion andfour molded elongated features extending away from the planar portionand arranged such that adjacent molded elongated features areperpendicular to each other and define a rectilinear space. Each moldedelongated feature comprises a first convex lens portion and a secondconvex lens portion. In some embodiments, the mold may be furtherconfigured to form one or more filled regions between the first convexlens portion and the second convex lens portion. In some embodiments,the mold may be further configured to form one or more features forsupporting one or more of (i) ambient light sensing, (ii) tunneldetection, and (iii) sunload sensing. The additional features may beformed in the one or more filled regions between the first convex lensportion and the second convex lens portion.

Other methods besides molding may be used to form a lens assembly andcover in accordance with an embodiment of the invention. For example,techniques exist and are being developed for producing lenses usingthree-dimensional (3D) printing. In some embodiments, a lens assemblyand cover in accordance with an embodiment of the invention may bemanufactured using such a 3D printing technique.

In various aspects, embodiments of the invention may include, but arenot limited to an integrated rain/light sensor and communication antennamodule, an integrated camera and communication antenna module, and amolded lens assembly for use with the rain/light sensors. The rainsensor generally cannot be reduced in size without affectingperformance. The larger the surface of the windshield sensed, the moreaccurate the estimate of the rain fallrate may be for wiper speedcontrol. A minimum gap is necessary between the emitter and thephotodiodes of the rain/light sensor.

The lens assembly is generally configured to efficiently couple lightfrom the emitter(s) into the windshield. A large sensing area on thefront surface is, in general, more sensitive. The molded lens assemblyin accordance with an example embodiment of the invention may provide afootprint/sensing area on the front surface of the windshield comprisingfour patches of light approximately 5×5 mm with more intense light, andalmost reaching 10×10 mm per patch. The rain/light sensor in accordancewith an example embodiment of the invention may accommodate differentnear infrared (NIR) transmittances (e.g., 16-85%), different windshieldthicknesses (e.g., 4.2 mm to 6.0 mm) and material, and windshieldcurvature greater than or equal to 1400 mm at sensor position. Ingeneral, the refractive index, n, of the windshield is assumed to beclose to 1.5. The bond between the optics of the molded lens assemblyand the windshield need to have n close to 1.5. In various embodiments,a carrier/substrate (or planar) portion of the molded lens assembly hasa thickness of approximately 2.0 mm. The thickness of the planar portionmay be increased if needed.

In an example, a rain sensor designed in accordance with an embodimentof the invention, using miniature SMD infrared emitters and through holephoto diode detectors, may fit in a space of approximately 12.7 mmbetween the windshield and the printed circuit board using simplerefractive optics for the emitters and photo diodes. In an example, twoLEDs (IREDs) and two photodiodes may be optically coupled by a moldedlens assembly in accordance with an embodiment of the invention. EachLED provides light to both photodiodes. A detector area 0.6×0.6 to 1×1mm² may be implemented. A smaller area may provide tighter tolerancesdue to mounting, different thicknesses, curvatures, etc.

About 20% of the light emitted by the emitter reaches the detectors withthe design described above (not considering attenuation in thewindshield). In an example, the detectors (with visible cut) may beimplemented using SFH2400 FA photo diodes; the emitters may beimplemented with vsmyl850 or SFH 4053 LEDs; a sun (e.g., visiblewavelength) detector may be implemented using a SFH3410 photo diode.

The terms “may” and “generally” when used herein in conjunction with“is(are)” and verbs are meant to communicate the intention that thedescription is exemplary and believed to be broad enough to encompassboth the specific examples presented in the disclosure as well asalternative examples that could be derived based on the disclosure. Theterms “may” and “generally” as used herein should not be construed tonecessarily imply the desirability or possibility of omitting acorresponding element.

While the invention has been particularly shown and described withreference to embodiments thereof, it will be understood by those skilledin the art that various changes in form and details may be made withoutdeparting from the scope of the invention.

The invention claimed is:
 1. An apparatus comprising: a windshield mountconfigured to mount a camera lens assembly to a windshield of a vehicle,wherein said camera lens assembly is configured to provide a forwardview and an upward view through said windshield of said vehicle; acamera lens attached to said camera lens assembly such that a field ofview of said camera lens is aligned with a horizontal plane and isdirected toward the front of said vehicle; and a single printed circuitboard mounted within said camera lens assembly at an angle to saidcamera lens, said single printed circuit board comprising an antenna, aground plane, and an image sensor, wherein (i) said antenna is disposedon a front surface of said single printed circuit board such that saidantenna is angled above said field of view of said camera lens and hasopen sky visibility directed towards a portion of the sky above saidvehicle, (ii) said ground plane is disposed either on said front surfaceor within a layer of said single printed circuit board, (iii) said imagesensor is mounted on a back surface of said single printed circuitboard, and (iv) said camera lens assembly is configured to focus animage of the forward view through said windshield and said camera lensonto said image sensor.
 2. The apparatus according to claim 1, whereinsaid antenna is configured to receive signals of a global positioningsatellite system.
 3. The apparatus according to claim 1, wherein saidantenna comprises a cellular communication antenna.
 4. The apparatusaccording to claim 1, wherein said antenna comprises a vehicle tovehicle (V2V), vehicle to infrastructure (V2I), or vehicle to everything(V2X) communication antenna.
 5. The apparatus according to claim 1,wherein said camera lens assembly further comprises a mirror configuredto direct light received through said camera lens onto said imagesensor.
 6. The apparatus according to claim 1, wherein said camera lensassembly further comprises a prism configured to direct light receivedthrough said camera lens onto said image sensor.
 7. The apparatusaccording to claim 1, further comprising a control circuit mounted onsaid back surface of said single printed circuit board, wherein saidcontrol circuit is configured to manage said image sensor.
 8. Theapparatus according to claim 7, wherein said control circuit is furtherconfigured to control emitters and detectors of one or more light/rainsensors.
 9. The apparatus according to claim 8, further comprising: alens assembly mounted to said front surface of said single printedcircuit board and configured to provide at least four orthogonal opticalpaths and a central atrium, wherein said central atrium is aligned withsaid antenna; a first emitter and a second emitter mounted on saidsingle printed circuit board, said first emitter located between a firstpair of said four orthogonal optical paths, and said second emitterlocated between a second pair of said four orthogonal optical paths; anda first detector and a second detector mounted on said single printedcircuit board, said first detector located between a third pair of saidfour orthogonal optical paths, and said second detector located betweena fourth pair of said four orthogonal optical paths.
 10. The apparatusaccording to claim 9, wherein said single printed circuit board issquare, said first and said second emitters are mounted in oppositecorners on said front surface of said single printed circuit board, andsaid first and said second detectors are mounted on said back surface ofsaid single printed circuit board and are aligned with respective viasin said single printed circuit board.
 11. The apparatus according toclaim 1, wherein said apparatus is configured to be mounted near arearview mirror of said vehicle.
 12. The apparatus according to claim 1,wherein said apparatus is configured to be mounted in front of arearview mirror of said vehicle.
 13. A method of generating automateddriver assistance information comprising: mounting a camera lensassembly to a back surface of a windshield of a vehicle using awindshield mount enclosing said camera lens assembly, wherein saidcamera lens assembly is configured to provide a forward view and anupward view through said windshield of said vehicle, align a field ofview of a camera lens attached to said camera lens assembly with ahorizontal plane, and direct said field of view of said camera lenstowards the front of said vehicle; and encasing a single printed circuitboard within said camera lens assembly, wherein (i) said single printedcircuit board is mounted at an angle to said camera lens and comprisesan antenna, a ground plane, and an image sensor, (ii) said antenna isdisposed on a front surface of said single printed circuit board suchthat said antenna is angled above said field of view of said camera lensand has open sky visibility directed towards a portion of sky above saidvehicle, (iii) said ground plane is disposed either on said frontsurface or within a layer of said single printed circuit board, (iv)said image sensor is mounted on a back surface of said single printedcircuit board, and (v) said camera lens assembly is configured to focusan image of the forward view through said windshield and said cameralens onto said image sensor.
 14. The method according to claim 13,wherein said antenna is configured to receive and/or transmit one ormore of signals of a global positioning satellite system, signals of acellular communication system, signals of a vehicle to vehicle (V2V),vehicle to infrastructure (V2I), or vehicle to everything (V2X)communication system, and one or more portions of a wirelesscommunication frequency spectrum.
 15. The method according to claim 13,wherein said camera lens assembly further comprises a mirror configuredto direct light received through said camera lens onto said imagesensor.
 16. The method according to claim 13, wherein said camera lensassembly further comprises a prism configured to direct light receivedthrough said camera lens onto said image sensor.
 17. The methodaccording to claim 13, wherein said camera lens assembly furthercomprises a control circuit mounted on said back surface of said singleprinted circuit board, wherein said control circuit is configured tomanage said image sensor.
 18. The method according to claim 17, furthercomprising configuring said image sensor to simultaneously deliverhigh-quality video and scene information content.
 19. The methodaccording to claim 17, wherein said image sensor is configured tosupport automotive applications that involve concurrent vision andsensing functions.
 20. The method according to claim 18, furthercomprising: mounting a light/rain sensor lens assembly between saidfront surface of said single printed circuit board and said back surfaceof said windshield, wherein (i) said light/rain sensor lens assembly isconfigured to provide at least four orthogonal optical paths and acentral atrium, (ii) said central atrium is aligned with said antenna,(iii) said single printed circuit board includes a first emitter, asecond emitter, a first detector, and a second detector, said firstemitter located between a first pair of said four orthogonal opticalpaths, said second emitter located between a second pair of said fourorthogonal optical paths, said first detector located between a thirdpair of said four orthogonal optical paths, and said second detectorlocated between a fourth pair of said four orthogonal optical paths.